3D Measurement

Intel has accepted Optoniks 3D measurement product for socket measurement. The product stands out for its ability to effectively measure shadows and dark/ shiny surfaces. Optoniks is already working with a production line integrator to use the product on high-end components requiring 100% quality control, serving Intel’s supply chain and elsewhere.

Non-Destructive Measure

Non-Contact and No-Coating are two aspects of Optoniks’ 3D profilometry system that makes it a Non-Destructive Measurement (NDM) metrology tool.

3D Shadow Removal™

Optoniks has developed a technique based on multiple camera angles to effectively remove errors in profile measurement due to obstruction of light at particular locations.

HDR Metrology™

Optoniks has developed the 3D HDR Metrology™ technology to overcome the issue of high-contrast ratio objects and surfaces in dimensional metrology.

ContourPro 4D Distinguishing Characteristics:

(Patent Protected)

▪ Non-Contact, Non-Coating and Non-Destructive Measurements
▪ 3D Shadow Removal
▪ Parallel Processing Metrology
▪ Film Layer Thickness with Scattering Material
▪ SGA & Warpage Solutions
▪ Thin layer PCB Warpage measurement
▪ Automated Inspection Capability for In-Line Quality Control

ContourPro 4D Specifications

Measurement Items	Warpage Measurement Flat Measurement Socket Pin Coplanarity Socket Pin 3D Coordinate
Field of View (FOV)	Adjustable up to very large apertures
Z-Range	Proportional to XY aperture
XY-resolution	Down to 2µm (Socket Pin)
Measurement Repeatability (Height)	σ ⩽ 2µm
Stand Alone System	585mm(23") x 480mm(19") x 760mm(30") (W x D x H)
Integration Module	510mm(20") x 255mm(10") x 290mm(11.5") (W x D x H)

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